ASMPT Names Bassel Haddad Group CEO to Drive AI Packaging Growth
The semiconductor equipment supplier taps former Intel and SkyWater executive to succeed retiring CEO Robin Ng.
ASMPT has appointed Bassel Haddad as its Group Chief Executive Officer and Executive Director. The leadership transition arrives as the semiconductor packaging industry faces surging demand driven by the global buildout of artificial intelligence infrastructure.
Haddad succeeds Robin Ng, who is retiring after more than two decades with the company, including a six-year tenure as CEO. The appointment follows a February announcement in which Ng signaled his intention to step down. ASMPT, formerly known as ASM Pacific Technology and listed on the Stock Exchange of Hong Kong, is a primary supplier of equipment used in the critical final stages of chip production.
Strategic Industry Expertise
Haddad joins ASMPT with a deep background in foundry operations and technology platforms. He most recently served as Senior Vice President and General Manager of Foundry Solutions and Technology Platforms at SkyWater Technology. Prior to SkyWater, Haddad spent 14 years in various senior leadership positions at Intel, gaining extensive experience in the architectures and manufacturing processes required for high-performance computing.
This expertise arrives as ASMPT focuses on advanced packaging (AP) and mainstream solutions. The company has seen significant momentum in high-precision SMT solutions, photonics, and thermo-compression bonding (TCB)—technologies essential for the complex interconnects used in AI chips. As part of its current strategic realignment, ASMPT recently agreed to sell its NEXX business unit, which specializes in deposition equipment for advanced packaging, to Applied Materials for $120 million in cash.
The AI Packaging Pivot
The timing of this leadership change is critical. The semiconductor industry is shifting toward advanced packaging to overcome the physical limits of traditional chip scaling. AI capabilities are driving record demand for these specialized packaging techniques, which allow different chiplets to be integrated more efficiently to increase processing power and reduce latency.
Haddad’s experience at both a major integrated device manufacturer like Intel and a specialized foundry like SkyWater positions him to navigate the evolving requirements of next-generation AI systems. His appointment suggests a strategic move by ASMPT to tighten its integration with the foundry ecosystem as chip designers demand more sophisticated packaging platforms.
Future Outlook
As Haddad takes the helm, the industry will be watching how ASMPT leverages its growth in TCB and photonics to capture more of the AI infrastructure market. While the divestiture of the NEXX unit streamlines the company's portfolio, the focus now shifts to how the new CEO will scale the remaining advanced packaging business to meet the needs of hyperscalers and AI hardware developers. The company's ability to maintain its trajectory in the Hong Kong market while expanding its global footprint under new leadership remains a key point of interest for investors.