Samsung and ASML Launch €700 Million R&D Center for Next-Gen EUV Tech

Samsung Electronics and ASML have signed a memorandum of understanding to establish a next-generation semiconductor manufacturing technology R&D center in South Korea. The partnership aims to accelerate the development of ultra-fine manufacturing processes and lithography equipment essential for the next era of chipmaking.

The two companies will invest a total of 700 million euros into the joint facility. The center will focus specifically on High Numerical Aperture (High-NA) Extreme Ultraviolet (EUV) equipment, which is required for advanced processes below the 2nm threshold. This strategic collaboration is complemented by ASML's broader expansion in the region, including the opening of its Hwaseong New Campus, a project involving a 240 billion won investment.

The Race for Angstrom-Era Chips

EUV lithography is the critical technology used to etch the smallest, most efficient circuits onto silicon wafers. As the industry transitions from 3nm to 2nm and eventually to Angstrom-scale processes, High-NA EUV represents the next necessary technological leap. For Samsung, the stakes are particularly high; reports indicate that Samsung's current inventory of EUV equipment is significantly lower than that of its primary rival, TSMC, with some estimates suggesting Samsung possesses roughly half the number of units.

Strategic Implications

This alliance is a calculated move by Samsung to close the technological gap with TSMC in the foundry market while maintaining its lead in the memory sector. High-NA EUV is not only vital for logic chips but also for increasing yield and cost efficiency in DRAM production, where Samsung competes with SK Hynix and Micron. For ASML, the partnership provides direct access to Samsung's specialized expertise in memory exposure processes, allowing the equipment manufacturer to optimize its hardware for the world's largest memory producer.

Kyung Kye-hyun, president of Samsung Electronics’ Semiconductor Division, stated that the strengthened collaboration will contribute significantly to enhancing the global supply chain stability and Europe’s semiconductor value chain.

Future Outlook

Industry observers will now watch for the actual deployment of High-NA tools within Samsung's fabrication plants. While the R&D alliance signals long-term commitment, the company must balance these strategic investments against volatile capital expenditure planning. The success of the Hwaseong-based center will likely determine whether Samsung can reclaim the lead in the race toward sub-2nm supremacy.