SUSS MicroTec and Manz Asia Partner to Scale Semiconductor Inkjet Tech
The strategic collaboration aims to move inkjet solutions from process development into high-volume semiconductor manufacturing.
SUSS MicroTec SE and Manz Asia have entered a strategic collaboration to develop next-generation inkjet solutions for semiconductor manufacturing and advanced packaging. The partnership seeks to accelerate the transition of inkjet technology from the research and development phase into high-volume manufacturing.
The alliance merges SUSS MicroTec’s expertise in process equipment and advanced packaging with Manz Asia’s specialized inkjet capabilities and its established presence within the panel-level packaging ecosystem. According to Burkhardt Frick, CEO of SUSS, combining the two companies' respective strengths will allow them to accelerate technology development and reduce the time-to-market for future semiconductor solutions.
The Shift to Additive Processing
Inkjet technology is increasingly viewed as a superior alternative to conventional coating methods. Its primary advantages include significant material savings, improved cost efficiency, and the ability to achieve uniform deposition on complex 3D structures. These capabilities are particularly vital for the emerging field of panel-level packaging, which demands higher throughput and greater process flexibility to manage the increasing complexity of modern chip packages.
Robert Lin, CEO of Manz Asia, noted that the partnership sees strong potential to push these inkjet technologies beyond advanced process development and into the scale of high-volume semiconductor production.
Market Implications and Strategy
The move is a key component of SUSS MicroTec’s "Ambition 2030" strategy, which focuses on expanding the company's technology portfolio into high-growth semiconductor markets. The financial incentive for this shift is substantial; according to SUSS Research and Yole, the annual serviceable equipment market for semiconductor inkjet applications is projected to exceed USD 800 million by 2030.
By integrating inkjet printing into mass production, the semiconductor industry can move toward more scalable and material-efficient additive process technologies. This transition is essential for the creation of next-generation microchips that require precise, additive material application rather than traditional subtractive or blanket-coating methods.
Future Outlook
As the industry moves toward more complex 3D architectures and larger panel formats, the ability to deploy inkjet solutions at scale will be a critical differentiator for manufacturers. The collaboration between SUSS and Manz Asia positions both companies to capture a significant share of the projected market growth while providing the infrastructure necessary for the next wave of advanced packaging. The industry will now watch for the first high-volume manufacturing implementations resulting from this joint development effort.