TSMC Revives Longtan Science Park Expansion for Advanced Nodes
The chipmaker is moving forward with a 158-hectare expansion in Taoyuan to bolster capacity for 2nm and below processes.
TSMC is reviving plans to expand the Longtan Science Park in Taoyuan, Taiwan, to secure critical capacity for its next-generation semiconductor nodes. The move signals a strategic push to maintain the company's lead in advanced logic and packaging as global demand for AI-capable silicon intensifies.
The Phase III expansion of the Longtan site will encompass approximately 158.59 hectares of land. This area is intended for the construction of fabrication plants focusing on 2nm and below processes, as well as advanced packaging facilities. While some supply chain reports have suggested specific counts of 1.4nm fabs and CoWoS plants, TSMC and government agencies have not officially verified the exact number of facilities or their specific node assignments for this site.
Overcoming Local Hurdles
The path to expansion has not been seamless. The Longtan project previously faced significant delays and reports of being put on hold due to strong opposition from local residents. The primary point of contention centered on land acquisition for the Phase III expansion, reflecting the ongoing tension between industrial growth and local community interests in Taiwan's high-tech corridors. The decision to revive the project now underscores the urgency of the current semiconductor roadmap.
Strategic Integration
By concentrating advanced node production and advanced packaging within a single hub, TSMC can significantly reduce logistics overhead and accelerate the delivery of complex AI chips. The integration of bleeding-edge logic with advanced packaging is essential for the performance gains required by the current generation of AI accelerators. As the industry moves toward more complex chiplet architectures, the proximity of fabrication to packaging becomes a competitive advantage in reducing cycle times.
The Path Forward
This expansion aligns with TSMC's broader roadmap, which includes the expected mass production of 2nm chips in 2025. CEO C.C. Wei has emphasized that the company's advanced manufacturing process remains deeply rooted in Taiwan, making the successful development of the Longtan site a cornerstone of the global AI supply chain. Observers will now be watching for official confirmation on the specific number of plants and the exact timeline for the first 1.4nm wafers to roll off the line.