DB HiTek Pushes 8-Inch SiC Mass Production to Q1 2027
The South Korean foundry has completed reliability qualification for its 1,200V SiC MOSFET process but delayed its full-scale ramp.
South Korean specialty foundry DB HiTek is adjusting the rollout of its next-generation power semiconductor capabilities. The company has shifted its target for full-scale mass production of Silicon Carbide (SiC) and Gallium Nitride (GaN) wafers from the fourth quarter of 2026 to the first quarter of 2027.
Despite the timeline shift, DB HiTek has reached a critical technical milestone by successfully completing the reliability qualification for its 1,200V SiC MOSFET process on 8-inch (200mm) wafers. This qualification confirms that the process meets the rigorous stability and performance standards required for high-voltage power applications. The decision to postpone the mass production ramp is attributed to a combination of technical and market considerations.
The Shift to 8-Inch Wafers
DB HiTek is a prominent pure-play 8-inch foundry specializing in analog and power semiconductors, including power management ICs (PMICs) and display driver ICs (DDIs). The broader semiconductor industry is currently transitioning from 6-inch to 8-inch SiC wafers to increase production efficiency and lower the cost per die, as larger wafers allow for more chips per batch.
To support this transition, DB HiTek is leveraging its existing 8-inch infrastructure and expanding its Sangwoo Campus. This expansion is designed to secure the necessary capacity to manufacture next-generation power chips that can handle higher voltages and temperatures than traditional silicon.
Market Implications
Scaling the 8-inch SiC process is a strategic necessity for DB HiTek as it seeks to diversify its portfolio beyond legacy analog chips. The ability to produce 1,200V SiC MOSFETs positions the company to compete in the high-growth electric vehicle (EV) and industrial power markets, where efficiency and power density are paramount.
Historically, the company has viewed the automotive sector as a primary target. DB HiTek had originally aimed to supply 1,200V SiC MOSFETs for automotive applications as early as 2025. While the mass production date has moved, the successful reliability qualification indicates that the underlying technology is viable for these demanding environments.
Looking Ahead
Industry observers will now watch for DB HiTek's progress toward the new Q1 2027 deadline. The primary focus will be on whether the company can maintain its technical momentum and successfully integrate these processes into high-volume manufacturing. As the EV market continues to evolve, the timing of this ramp will determine how effectively DB HiTek can capture market share from established SiC providers and transition from a specialty analog foundry to a powerhouse in wide-bandgap semiconductors.