MicroVision Launches Semiconductor Unit to Drive Lidar 2.0 Strategy
The company integrates former Black Forest Engineering to bring custom ASIC and mixed-signal design in-house.
MicroVision, Inc. (NASDAQ: MVIS) has launched MicroVision Semiconductor, Inc., a dedicated organization designed to accelerate the development of next-generation lidar and intelligent sensing solutions. The move signals a strategic shift toward deeper vertical integration of the company's perception hardware.
Headquartered in Colorado Springs, Colorado, the new unit was formed following MicroVision's acquisition of Black Forest Engineering from Luminar. The organization brings a significant technical pedigree to the company, with a track record of delivering more than 300 custom mixed-signal integrated circuit designs. To handle production, MicroVision Semiconductor will leverage manufacturing support through established foundries, including TSMC, Tower Semiconductor, and X-FAB. The unit will focus specifically on expanding capabilities in photonic sensing, mixed-signal integrated circuits, and custom ASIC development.
The Shift to Lidar 2.0
This launch is a cornerstone of MicroVision's "Lidar 2.0" strategy. For years, the company focused primarily on MEMS-based laser beam scanning, but it is now transitioning toward a broader "perception stack" approach. Rather than producing standalone sensors, the company is moving toward integrated perception systems that combine sensors, electronics, and software into a single cohesive architecture. By bringing semiconductor design in-house, MicroVision aims to tighten the integration between these components, which the company believes will reduce development risk and shorten the time to market for its FMCW lidar initiatives and other autonomous applications.
Strategic Implications
Developing proprietary silicon allows MicroVision to create highly differentiated hardware that does not rely on off-the-shelf components. In the competitive landscape of autonomous driving and sensing, this level of customization is critical for improving the performance and scalability of advanced lidar systems. According to MicroVision CEO Glen DeVos, "Semiconductors are becoming one of the most important differentiators in advanced perception systems."
Beyond internal product development, the move creates a new commercial opportunity. MicroVision intends to use the unit to provide custom IC design services to external customers. This opens potential revenue streams across several high-stakes industries, including the defense, aerospace, and automotive sectors, where specialized sensing hardware is in high demand.
Looking Ahead
As MicroVision integrates the former Black Forest Engineering team, the industry will be watching how quickly this vertical integration translates into shipping products. The primary focus remains the execution of the FMCW lidar roadmap. While the semiconductor unit provides the tools for differentiation, the company's success will depend on whether these custom ASICs can deliver a measurable leap in sensing accuracy and cost-efficiency compared to existing market alternatives.