Navitas to Ship U.S.-Made Gen 5 GaNFast Wafers by September 2026

Navitas Semiconductor will begin shipping its fifth-generation GaNFast technology manufactured within the United States in September 2026. The move establishes a domestic production pipeline for critical power semiconductors used in AI infrastructure and national security applications.

Production is being executed through a strategic partnership with GlobalFoundries, utilizing the latter's 200mm Gallium Nitride-on-Silicon (GaN-on-Si) manufacturing facility located in Burlington, Vermont. By leveraging this facility, Navitas aims to stabilize the supply of its latest generation of power devices, which are designed to meet the rigorous energy demands of next-generation computing.

The Push for Domestic Production

Founded in 2014, Navitas operates as a pure-play next-generation power semiconductor company focusing on Gallium Nitride (GaN) and Silicon Carbide (SiC). The company entered into a long-term strategic partnership with GlobalFoundries in November 2025 to accelerate the innovation of GaN technology. This collaboration was specifically designed to reduce the industry's reliance on overseas manufacturing, a vulnerability that has become increasingly apparent as the demand for AI data center power solutions scales globally.

Strategic Implications for AI and Security

Securing a domestic supply chain for GaN semiconductors is viewed as a critical step for both U.S. national security and the expansion of AI infrastructure. By transitioning production to a U.S.-based 200mm foundry, Navitas significantly reduces geopolitical risks associated with semiconductor procurement. This shift aligns with broader federal initiatives to onshore the manufacturing of essential electronic components to ensure resilience against global supply chain disruptions.

Chris Allexandre, President and CEO of Navitas, stated that the partnership with GlobalFoundries has established a "trusted US-domestic manufacturing source" for Gen 5 and future generations of GaNFast. Allexandre noted that this capability will play a critical role in powering high-performance computing while strengthening the overall resilience of the U.S. semiconductor ecosystem.

Future Outlook

Industry observers will be watching the September 2026 rollout to see how quickly these domestic wafers can be integrated into commercial AI hardware. While the partnership secures the manufacturing foundation, the next phase involves scaling these 200mm wafers into finished power devices for a market that is currently seeing an unprecedented surge in power density requirements. The success of this domestic pivot may serve as a blueprint for other fabless semiconductor firms seeking to mitigate international logistics and political risks.